Affordable and quick Sony Vaio repair and replacement service provider in UK

VAIO has updated its popular 13-inch VAIO S notebook with Intel's latest eight-core Core i5 / i7 processor. In addition to the new processor, the system adds the company's new True Performance technology, designed to maintain a higher turbo frequency for longer periods. The new VAIO S also features a fingerprint reader and a TPM 2.0 module, with a focus on their professional features. At the same time, the VAIO S has retained their "classic" chassis and a set of connectors in 2018, so they do not support modern connectors such as USB Type-C.

The new VAIO S notebook is based on Intel's quad-core Core i5-8250U or Core i7-8550U processor with Intel UHD Graphics 620, 8-16 GB of LPDDR3-1866 memory and 256 GB, 512 GB. One of the main features of the 2018 VAIO S notebook is True Performance, which is expected to maximize the CPU's time to work at increased frequencies, making VAIO a competitive advantage over other notebooks based on the same processor.

VAIO's True Performance technology combines the increased power limit of the VAIO's CPU with a cooling system that can handle increased heat. For reference, Intel's Turbo Boost 2.0 technology increases the CPU frequency at 100 MHz when the operating system requests higher performance levels. Typically, the CPU will work at the maximum set Turbo Boost 2.0 for about 20 to 30 seconds (according to VAIO), and then reduce its clock due to heat and other factors. VAIO claims that even if it increases the processor peak time set in TB 2.0 to 40 seconds; this will not bring many benefits to the end user.

In contrast, VAIO's technicians have increased the TDP limits of Intel CPUs to extend the chip's operating time above the nominal frequency (or frequency) but below the peak frequency defined by TB 2.0. The company did not say whether it would increase the TDP of the 8th generation Intel Core i5 / i7 CPU to 25W (15W) (Intel allowed boost and configurable TDP uplink), which will explain and define higher frequencies. At the same time, VAIO acknowledged the need to redesign its CPU VRM and cooling system to eliminate additional heat. The new cooler has a thicker vent (probably an enlarged radiator) and a new fan speed control algorithm to ensure the chip does not overheat.

For monitors and physical dimensions, the new VAIO S features a 13.3-inch screen with a resolution of 1920 × 1080, weighs only 1 kg (2.34 lbs.) and has only 15-17, 8 mm thick. Compared to the 2016 VAIO S, the thinnest part of the chassis is about 1.8mm thick and the thickest part is about 0.2mm thick, which is not a big portability problem.

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